Stamp Festival, 2012

Supplementary Rules

1. Rules of Activity:

  • The participant has to use the electronic components provided by the organizer to make a 3-dimensional work within the time limit. The design of the work is not limited.
  • The participant will be provided with a "component list" before the activity starts.
  • After the museum staff has announced the start of time-keeping, the participant can take the components from the component racks without restriction on the type and quantity of components. However, the participant cannot put the unused components back into the component racks.
  • The finished work should contain the "required components" on the "component list".
  • The time limit is 1 hour 30 minutes. When time is up, the participant has to stop making the work and wait for the judges to score.

2. Scoring Criteria:

  • Integrity (20%): Complete and steady work.
  • Relevance to science (20%): Use of science theory and techniques, e.g. making a light on, on/off switch, etc.
  • Artistic & creative design (50%): Outlook and decoration of the object, including the use of non-required components, materials, special functions, etc.
  • Material-saving (10%): If the participant has unused materials, 5% will be deducted for every 25g, and maximum deduction is 10%.

3. Component List:

Electronic Components Actual Component Symbol
Resistance Resistance Resistance
Variable Resistance Variable Resistance Variable Resistance
LED LED LED
Battery Battery Battery
Capacitor Capacitor Capacitor
Switch Switch Switch
Integrated Circuit(IC) Integrated Circuit Integrated Circuit
Motor Motor Motor
Buzzer Buzzer Buzzer
IC Socket IC Socket
Printed Circuit Board (PCB) Printed Circuit Board
Other materials that are non electronic components

4. Tools: The organizer will provide the tools such as scissors, tapes, glue, sharp-nose pliers, flat-nose pliers, rulers, pens and paper cardboards, etc. Participants are welcome to bring their own tools, but dangerous tools are prohibited (soldering iron, electric drill or hot melt adhesive, etc).